I bought a new Briggs and Stratton control boarad, and it had the same problem of no 12v+ being sent to the LP valve solenoid terminal, so jumpering that allowed my engine to run. But the NEW control board 353311GS would not send 240vac from the generator to my 200 amp Briggs ATS. So in testing why, I happen to test for continuity between the 10-pin connector and the corresponding solder joints on the printed circuit board. Only one showed continuity, the other 9 of 10 were an open circuit on my Klein VOM.And this had been shipped to me by Outdoor Power Direct. I wasted so much time on Briggs and Stratton that I asked ai on a Google search about the poor quality control problem. Here it is...wow am I glad to be retired from manufacturing!
On a Briggs and Stratton printed control boaard I just received today from Amazon.com, 9 of the 10 pin connections showed no continuity between the pin and the corresponding solder joint. How can such deplorablely poor QC exist..is this likely made in the far East?
From the user's description, it sounds like the user is referring to a "cold solder joint" where the solder on the pins did not melt properly or solidified too quickly, resulting in a poor connection. It's essentially a type of soldering defect that impacts the conductivity and reliability of the electrical connection between components and the board. This issue is commonly identified by visual inspection, as cold solder joints often appear dull and grainy rather than smooth and shiny. You can also detect it using a multimeter for continuity or resistance tests.
Regarding the possibility of it being manufactured in the Far East, Briggs & Stratton has a global presence and manufactures products in various locations, including countries in the Far East,
such as China. However, pinpointing the exact manufacturing location of a specific control board without more information is difficult.
Why does such a problem exist?
Such issues can arise due to various reasons during the soldering process:
Insufficient Heat: Not applying enough heat during soldering can prevent the solder from melting and flowing properly.Dirty Surfaces: Contamination on the pins or board can hinder the solder from bonding securely.Disturbance during Cooling: Any movement or shaking of the board or components before the solder cools and solidifies can disrupt the joint.Incorrect Solder or Technique: Using the wrong type of solder or applying it incorrectly can also lead to poor connections.
What next?
Since you just received the product, consider contacting the seller on Amazon.com to discuss a return or exchange for a replacement that functions as expected. You might also consult a qualified technician for potential rework or replacement of the faulty part.
AI responses may include mistakes.
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What are other common defects in PCB assembly beyond soldering issues?
Beyond soldering issues, a range of other defects can affect the reliability and functionality of a PCB assembly
Manufacturing and fabrication defects
Layer Misalignment / Registration Issues: In multi-layer PCBs, the different layers (e.g., signal, ground, power) might not be perfectly aligned during the manufacturing process, potentially causing signal disruptions or short circuits.Poor Via Plating: Vias are critical connections between layers. Poor plating within vias can lead to breaks in circuit continuity or unreliable connections between layers.Delamination and Blistering: These defects involve the separation of layers within the PCB structure or the formation of bubbles or swelling on the surface. They can be caused by moisture absorption, thermal stress, or weak bonding, leading to reduced mechanical strength and compromised signal integrity.Trace width inconsistencies: Variations in the width of conductive traces can lead to hotspots and affect the performance of the board.Open and Short Circuits (Non-Soldering Related): Open circuits can result from over-etching, damage to traces during handling, or problems with the plating process. Short circuits can occur due to design errors, inadequate spacing, or flaws in the solder mask application.Slivers: These are thin, elongated pieces of copper or solder mask that can detach during manufacturing or assembly, potentially causing short circuits or corrosion.Plating Voids: Voids in the metal plating, particularly in plated through-holes, can hinder electrical current flow and impact the board's functionality.Solder Mask Inconsistency: The solder mask protects copper traces, and its absence or inconsistencies, especially between pads, can lead to solder bridges and short circuits. Component and assembly errors
Component Misplacement: This involves incorrectly positioned components on the PCB, either due to human error during manual assembly, machine misalignment in automated processes, or design flaws.Wrong Components or Polarity Reversal: Using incorrect components (e.g., a wrong resistor value) or installing a polarized component backwards can lead to immediate malfunction or long-term damage.Missing Components: Components can be completely omitted during the assembly process due to errors in design files, bill of materials, or during automated placement.Incompatible Component Height Sequence (Wave Soldering): During wave soldering, taller components placed before shorter ones can block the solder wave from properly reaching the shorter components, resulting in insufficient or incomplete solder joints.Insufficient Component Clearances: Inadequate spacing between components, copper features, or the board edge can lead to assembly difficulties, short circuits, or problems during testing and rework.Component Damage: Components can be physically damaged during handling, placement, or due to ESD (Electrostatic Discharge) or EOS (Electrical Overstress).
Design-related errors
Design Flaws: Inadequate spacing, thermal imbalances, or improper pad designs can create potential failure points during assembly and operation.Incorrect Footprints: Errors in the design file regarding the size and location of the pads for component attachment can lead to soldering problems and component placement issues.Inefficient Thermal Management: Inadequate design for heat dissipation, improper component spacing, or overlooking the thermal expansion coefficients of materials can lead to overheating and potential damage.Acid Traps: These are acute angles in the circuit design that can trap etching acid, leading to excessive corrosion and potentially open circuits.Routing Errors: These can involve unrouted signals (breaks in the connections between components) or shorted circuits (unintended connections between conductive paths).
Other factors
Contamination: Dust, fibers, hair, chemical residues, or moisture can contaminate the PCB surface, leading to reduced solder quality, corrosion, or short circuits.Human Error: Despite automated processes, human intervention can still lead to errors like misinterpreting design files or incorrect part loading.Environmental Factors: Exposure to moisture, dust, extreme temperatures, and thermal cycling can degrade PCBs over time and cause failures.Electrical Overstress: Applying voltage or currents beyond the PCB's design specifications can cause immediate or gradual failure. By addressing these defects through careful design practices, robust manufacturing processes, and thorough quality control measures, manufacturers can produce reliable and high-quality PCB assemblies.